Ph.D. candidate from School of Electronic and Computer Engineering, Shenzhen Graduate School of Peking University
He received the Bachelor's degree in Microelectronics Science and Engineering from College of Physical Science and Technology of Xiamen University in 2017, and he is currently pursuing the Ph.D. in Microelectronics and Solid State Electronics at School of Electronic and Computer Engineering, Shenzhen Graduate School of Peking University. His research focuses on sensor modeling, system in packaging, 3D integration, and Through-Silicon Vias (TSVs).
