This paper presents a sensor-package co-simulation, design, and optimization approach for a multi-channel pressure scanning valve. The methodology combines finite element analysis to design both the sensor chip and its packaging, focusing on the interactions between these components to improve overall sensor performance. By systematically simulating and optimizing the structural characteristics of the chip-such as the thin-film diaphragm-and analyzing various packaging materials and configurations, we aim to mitigate the adverse effects of packaging-induced stress. Results demonstrate that careful selection of packaging materials and design parameters can effectively reduce packaging-related measurement errors, thereby improving the accuracy of the sensor.